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EECS-2016-21.pdf
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Design of Ultrasonic Power Link for Neural Dust

Authors:
Seo, Dongjin
Technical Report Identifier: EECS-2016-21
May 1, 2016
EECS-2016-21.pdf

Abstract: This report presents a new method of wireless power telemetry using ultrasound to power sub-mm sized neural implant called neural dust. It details the system design trade-offs and ultimate size, power, bandwidth scaling limits, as well as experimental results to verify the model framework. The proposed system improves the power transfer efficiency by up to 8 orders of magnitude compared to the traditional EM-based wireless powering at the same size scale and can be engineered to operate down to 10’s µm scales. The extreme scalability of an ultrasound-based neural recording system makes it an attractive candidate for enabling a wireless interface to neural implants for applications such as brain-machine interfaces.